ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,879, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor chip and semiconductor packag... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,880, issued on Nov. 3, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Dual-side bridge chips connecting two semicond... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,881, issued on Nov. 3, was assigned to Infineon Technologies AG (Neubiberg, Germany). "3D-IC for RF applications" was invented by Hans Taddi... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,882, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufactur... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,883, issued on Nov. 3, was assigned to MediaTek Inc. (Hsinchu City, Taiwan). "Semiconductor package and fabrication method thereof" was inve... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,884, issued on Nov. 3, was assigned to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING Co. LTD. (Wuhan, China). "Semiconductor device having deep t... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,885, issued on Nov. 3, was assigned to AUO Corp. (Hsin-Chu, Taiwan). "Electronic apparatus and method of fabricating the same" was invented ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,886, issued on Nov. 3, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with spacer and method for fa... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,887, issued on Nov. 3, was assigned to LUMILEDS LLC (San Jose, Calif.). "Polychromic LED stack" was invented by Zhongmin Ren (Danville, Cali... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,888, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Structure and formation method of pac... Read More